#Soldering profile for Aria G25 SoM	

Aria G25 is compatible with the standard J-STD-020C for reflowing production process.	

Aria is a Pb/Free and RoHS product.

Aria SoM is a Level 4 Moisture Sensitivity device

| Parameter | Value |
|-|-|
| Average Ramp-up Rate (217°C to peak) | 3°C/s max |
| Preheat Temperature (175°C +-25°C) | 120 sec max |
| Temperature maintained above 217°C | 40s to 100s |
| Time within 5°C of Actual Peak Temperature | 20s to 40s |
| Peak Temperature range | 260°C +0°C |
| Ramp Down rate | 6°C/s max |
| Time 25°C to Peak Temperature | 7 min. max |

Suggested peak reflow temperature is from 235°C to 245°C for solder paste SAC305 (SnAg3.0Cu0.5).

Absolute max reflow temperature is 260°C PPT (Package Peak Temperature as measured at top of package surface)

It is suggested to mount the module on the last reflow of the carrier board

A maximum of two reflow passes is allowed per board

With Vapour phase ovens the suggested parameters are: 
* max temperature: 240°C;
* ramp rate between 25°C and 190: 0.5°C/s, 
* very gentle knee then to avoid tombstoning and then 3°C/s to the top temperature (240°C) 
* staying at 240°C for 25..30s 
* then ramp down at max 5°C/s

##Storage

* Aria SoM are distributed in sealed bags.
* Shelf life for sealed bag: 6 months at <40&deg;C / 90%RH
* After bag is opened, for Aria boards subjected to reflow or other high temperature process must be mounted within 72 hours at conditions of <30&deg;C / 60% RH or they have to be stored at <10% RH
* Aria devices left open for more than 72 hours requir bake, before mounting.
* When requiring bake Aria SoM may be baked for 48 hours at 110&deg;C+-5&deg;C
* Refer to IPC/JEDECJ-STD-033 for bake procedure