Aria G25 is compatible with the standard J-STD-020C for reflowing production process.
Aria is a Pb/Free and RoHS product.
Aria SoM is a Level 4 Moisture Sensitivity device
|Average Ramp-up Rate (217°C to peak)||3°C/s max|
|Preheat Temperature (175°C +-25°C)||120 sec max|
|Temperature maintained above 217°C||40s to 100s|
|Time within 5°C of Actual Peak Temperature||20s to 40s|
|Peak Temperature range||260°C +0°C|
|Ramp Down rate||6°C/s max|
|Time 25°C to Peak Temperature||7 min. max|
Suggested peak reflow temperature is from 235°C to 245°C for solder paste SAC305 (SnAg3.0Cu0.5).
Absolute max reflow temperature is 260°C PPT (Package Peak Temperature as measured at top of package surface)
It is suggested to mount the module on the last reflow of the carrier board
A maximum of two reflow passes is allowed per board
With Vapour phase ovens the suggested parameters are: * max temperature: 240°C; * ramp rate between 25°C and 190: 0.5°C/s, * very gentle knee then to avoid tombstoning and then 3°C/s to the top temperature (240°C) * staying at 240°C for 25..30s * then ramp down at max 5°C/s